LAC Peer Reviews
Design Phase 9/1996 - 10/1997
- Informal reviews among LAC Team and other AETD branches
- Electrical interface reviews (WARP, 1773)
- Thermal and mechanical interface reviews (Swales)
Thermal/ Mechanical Board Design Review 09/1998
- LAC, Swales (J. Lorenz): Heat sinks and structural elements added to digital and power boards
Digital Board Design Review 12/18/1998
- LAC, EO-1 and Code 551: Significant design modifications (synchronous operation, improved modeling procedures)